Last edited by Gurr
Friday, July 31, 2020 | History

1 edition of Standalone Tensile Testing of Thin Film Materials for MEMS found in the catalog.

Standalone Tensile Testing of Thin Film Materials for MEMS

by Arash Tajik

  • 16 Want to read
  • 12 Currently reading

Published by INTECH Open Access Publisher .
Written in English


Edition Notes

En.

StatementNEMS Applications
ContributionsHamid Jahed, author
The Physical Object
Pagination1 online resource
ID Numbers
Open LibraryOL27074775M
ISBN 109535103067
ISBN 109789535103066
OCLC/WorldCa884217599

The design of reliable micro electro-mechanical systems (MEMS) requires understanding of material properties of devices, especially for free-standing thin structures such as membranes, bridges, and cantilevers. The desired characterization system for obtaining mechanical properties of active materials often requires load control.   The investigation of strain-rate effects on the mechanical response and characteristics of thin free-standing films is crucial for the design and fabrication of more reliable MEMS devices. It is also of high interest from the scientific and materials engineering views. In this paper we present a novel apparatus and a procedure for tensile testing of thin free-standing films under a wide range.

  Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile . Electrochemistry; Electronic Materials; Energy Storage; Mechanical Behavior of Materials; MEMS (Micro-Electro-Mechanical Systems); Nanotechnology; Surfaces, Interfaces, and Thin Films Harry L. Tuller R.P. Simmons Professor of Ceramics and Electronic Materials.

Get this from a library! Reliability of MEMS: testing of materials and devices. [Osamu Tabata; Toshiyuki Tsuchiya;] -- Now available in softcover, this book closely examines the enabling technologies for the fabrication of micro- and nanodevices. Divided into two clearly structured sections, the first begins with an. This section draws heavily on the book chapter “Thin Films for Micro-electronics and Photonics: Physics, Mechanics, Characterization, and Reliability,” by D. T. Read and A. A. Volinsky.1 The main methods in current use for mechanical characterization of thin films include microtensile testing.


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Standalone Tensile Testing of Thin Film Materials for MEMS by Arash Tajik Download PDF EPUB FB2

Standalone Tensile Testing of Thin Film Materials for MEMS/NEMS Applications Nano-indentation is the advanced version of the classical hardness test method. In this technique, the specimen is loaded by a sharp indenter and the load-displacement (P-h) of the indenter is monitored during loading and unloading.

The reduced elastic modulus and. Standalone Tensile Testing of Thin Film Materials for MEMS/NEMS Applications i nt e r f e r om e t ry h a v e m u c h h i g h er r e so l ut i o n a n d c a n b e u se d t o e x tr a c t s t r. Standalone Tensile Testing of Thin Film Materials for MEMS/NEMS Applications.

By Arash Tajik and Hamid Jahed. Submitted: March 2nd Reviewed: July Author: Arash Tajik, Hamid Jahed. Thin film materials carry mechanical loads in thermal actuators, switches and capacitors in RF MEMS, optical switches, micro-mirror hinges, micro-motors, and many other miniaturized devices.

In these applications, one of the main criteria to choose a specific material is its Author: Arash Tajik, Hamid Jahed. Standalone Tensile Testing of Thin Film Materials for MEMS/NEMS Applications Nano-indentation is the advanced version of the classical hardness test method.

A newly developed approach to thin-film tensile testing has been utilized for evaluating ultra-thin-films of about nm in thickness. Thin sputtered metal films deposited on gm thick polyimide film substrates were tested using a Mesotronix nanotensiometer. The methodologies allow freestanding single or multilayered thin-film specimens to be fabricated separately from the MEMS actuators.

For the uniaxial tension test, tensile forces are applied by lateral comb drive actuators capable of generating a total load of. To measure the humidity effect, two thin film tensile testers are used. One can perform test in air, and the other in a vacuum.

With these apparatus, the tensile strength and the fracture toughness of the SiO 2 films are measured both in a vacuum and in air.

The mean strength is – GPa in a vacuum and – GPa in air, and the mean. Bulge testing involves pressurizing a freestanding thin film that is clamped at its edges to induce tensile stresses in the membrane (Figure 6); the pressure and deflection of the membrane are measured independently, as introduced by J.J.

Vlassak and W.D. Nix. 70 This has been applied to the testing of various metal films with and without. Thin film tensile tester. Two types of thin film tensile testers using the electrostatic force grip are constructed. The one is assembled in the sample chamber of a scanning electron microscope (SEM).

This tester was used for polysilicon thin film; only the probe has changed to apply to insulating films. Corpus ID: An Experimental Technique for the Study of the Mechanical Behavior of Thin Film Materials at Micro- and Nano-Scale @inproceedings{TajikAnET, title={An Experimental Technique for the Study of the Mechanical Behavior of Thin Film Materials at Micro- and Nano-Scale}, author={Arash Tajik}, year={} }.

6 1 Evaluation of Mechanical Properties of MEMS Materials and Their Standardization where l and w are the length and width, respectively, of the beams. If the center mass consists of thin fi lms and the stress in the mass is released, the additional stress is applied on the supporting beam.

properties. Therefore mechanical properties of thin films used in MEMS need to be accurately evaluated they should be measured at the same scale as micro- and nano-devices since they differ from bulk material properties.

Thin-film and bulk materials usually have different compositions, phase and microstructure and the formation process for thin. The thin film tensile tester was built using this system. The accuracy and reliability of this method were assured by comparing it with other tensile‐testing methods using single‐crystal silicon specimens.

The result shows good agreement between the testing methods. Tensile testing of MEMS materials Abstract: This paper describes tensile testing of thin films, such as single crystal silicon, polysilicon, silicon dioxide, silicon nitride, and metals. These films are used as mechanical structures in MEMS devices, which are strongly requested to evaluate their reliability before they become products.

The activation energy for stress-relaxation was eV. The experimental data is fitted with the analytical model to find the relaxation time.

The thin film on the MEMS tensile tester is prepared by sputter-deposition. By optical lithography and ICP DRIE Si etching, the MEMS tensile tester with a free standing beam is fabricated.

In order to improve the reliability of Micro-electro-mechanical Systems (MEMS) designs, evaluations of the mechanical properties of soft magnetic materials are needed. In this paper, we present a tensile testing method to characterize the mechanical properties of microscale electroplated permalloy (80 wt% Ni, 20 wt% Fe) films.

The gauge section of the specimen is 50 mum wide, long and 5. Tensile testing also known as tension testing,is a fundamental materials science test in which a sample is subjected to a controlled tension until failure.

Properties that are directly measured via a tensile test are ultimate tensile strength maximum elongation and reduction in area.3/5(8). buy bs en semiconductor devices - micro-electromechanical devices - part bending fatigue testing method of thin film materials using resonant vibration of mems structures (iec ) from sai global.

The mechanical testing of thin films is non-trivial, due to their very fine dimensions. Kim et al. use the inherent surface tension of water as a platform for the frictionless tensile testing of.

The data are used to construct performance maps showing the capability of existing actuators and sensors in terms of maximum force and displacement capability, resolution and frequency.

These can also be used as a preliminary design tool, as shown in a case study on the design of an on-chip tensile test machine for materials in thin-film form.The material used in MEMS technology is predominantly silicon, but thin films made from other materials such as germanium and gallium arsenide are also used.

Silicon materials are not considered typically to have properties suited for mechanical applications, and so data regarding their properties are not as extensively studied.Abstract.

This paper represents the results of tensile test for NiCo thin films, to investigate the size effect on tensile properties. An axial loading tensile tester developed by authors was used to measure the mechanical characteristics of thin film materials.